Marking on hard material Possible to mark less 5μm line width
Possible to mark hard material like metal, glass, silicon wafer, etc
Application
 Substance on a surface Picking up a substance & transferring it |
| Exposed surface of buried subject Removal of disused part |
| Dig buried substance Isolation |
| Contamination in adhesive material Grasp a subject and delivery |
| FIB Lift-out Posture control and deliver (10 micro meters) |
| Marking on hard material Possible to mark less 5μm line width |
News&Topics
| 【Our manipulation system “Axis Pro” was shown on the TV program】() |
| New Release of “Probe Bender” Product.() |
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Resolves an issue related to particulate sampling. Knowledgeable staff will answer. -
If you would like to consider the introduction, already your material for those of you can see immediately.
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Phone ＋81-54-269−5002
FAX ＋81-54-269−5003
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