|Substance on a surface Picking up a substance & transferring it|
|Exposed surface of buried subject Removal of disused part|
|Dig buried substance Isolation|
|Contamination in adhesive material Grasp a subject and delivery|
|FIB Lift-out Posture control and deliver (10 micro meters)|
|Marking on hard material Possible to mark less 5μm line width|
Tungsten carbide tool
|Pick-up adhered substance out of surface of a sugar-coated tablet||Plane cutting of surface of polyimide by each 50μm width||Excision of enameled wire||Plane cutting of a buried foreign substance of a resin|
5 μm size probe can cut a tiny area of surface of hard material like metal, a silicon wafer, and glass, and mark targets before FIB processing.
Since the tip of the figure is flat-head screw driver shaped, “micro peeler” can operate various materials, such as plane cutting on the surface of a polymer material, such as a high barrier film, cutting of buried substance, excision of projective substances, pinpoint excision of IC bonding wire, and a cut of minute wiring.
“knife edge” is very useful tool to extract a foreign substance buried in a tablet, nonferrous metal, a rigid plastic, etc.
Hard-Metal Tools (usage)
|Probes, tip diameter 5μm (5pcs)||CP-005||Marking of a hard sample, etc.|
|Micro Peelers (3pcs)||MPE-1||for cutting material such as resin and glass, etc.|
|Micro Peelers-Medium (3pcs)||MPE-2||for cutting material such as resin and glass, etc.|
|Micro Peelers-Large (3pcs)||MPE-4||for cutting materials such as resin and glass (can use for manual manipulation)|
|Micro Peelers Set, MPE-1/2/4, each 1pc (3pcs)||MPE-SET||Micro Peelers(MPE-1/2/4) each 1pc|
|Knife Edges (3pcs)||KE-1||for pinpoint cutting of resin, etc.|
|Knife Edges S (3pcs)||KE-2||for pinpoint cutting of resin, etc.|
|Hard Tools Set (3pcs)||HT-SET||Probes(CP-005),